Dynamic Random Access Memory DRAM 8Gb x16 x2 channel Mobile LPDDR4/LPDDR4X IS43LQ32256B-062BLI
FEATURES
•
Configuration:
- 256Mb x16 x 2 channels - 8 internal banks per channel
• Low-voltage Core and I/O Power Supplies
VDD1 = 1.70-1.95V
VDD2 = 1.06-1.17V
VDDQ = 1.06-1.17V (LPDDR4)
VDDQ = 0.57-0.65V (LPDDR4X)
•
•
LVSTL(Low Voltage Swing Terminated Logic) I/O
Interface
Internal VREF and VREF Training
• Dynamic ODT :
DQ ODT :VSSQ Termination
CA ODT :VSS Termination
• Max. Clock Frequency : 1866MHz (3733Mbps)
• 16n Pre-fetch DDR architecture
• Single data rate (multiple cycles) command/
address bus
• Bidirectional/differential data strobe per byte of
data (DQS/DQS#)
• Programmable and on-the-fly burst lengths
(BL=16, 32)
• ZQ Calibration
• Operation
Industrial
Temperature
(TC = -40°C to 95°C)
Automotive, A1 (TC = -40°C to 95°C)
Automotive, A2 (TC = -40°C to 105°C)
Automotive, A3 (TC = -40°C to 125°C)
• Clock-Stop capability
any published information and before placing orders for products.
DESCRIPTION
The IS43/46LQ32256B and IS43/46LQ32256BL are
8Gbit CMOS LPDDR4 SDRAM. The device is orga
nized as 2 channels per device, and each channel is
8-banks and 16-bits. This product uses a double-da
ta-rate architecture to achieve high-speed operation.
The double data rate architecture is essentially a 16N
prefetch architecture with an interface designed to
transfer two data words per clock cycle at the I/O pins.
This product offers fully synchronous operations
referenced to both rising and falling edges of the clock.
The data paths are internally pipelined and 16n bits
prefetched to achieve very high bandwidth.
• On-chip temperature sensor whose status
can be read from MR4
• 200-ball x32 BGA Package ( 10x14.5 mm)
| Product Catalogue | Memory > Dynamic Random Access Memory (DRAM) |
| Universal packaging | FBGA-200 |
| RoHS | Compliance |
| Installation method | Surface mount installation |
| Operating temperature | -40°C to 95°C |
| Length * Width * Height | |
| Application grade | |
| Packaging method | |
| Minimum working power supply voltage | |
| Organization | 256Mb x16 |
| Data bus width | |
| Interface type | |
| Storage capacity | 8Gb |
| Maximum supply current | |
| Maximum working power supply voltage | |
Packaging and transportation instructions
- According to the standard export packaging.
Customers can choose from cartons, wooden cases and wooden pallets according to their own requirements.
Q&A
1. How to obtain the price?
We usually quote within 24 hours after receiving your inquiry (except weekends and holidays). If you are in urgent need of a price, please send us an email or contact us in any other way so that we can provide you with a quotation.
2. What is your delivery time?
This depends on the quantity of the order and the season in which you place the order. Usually, we can ship the goods within 7 to 15 days (for small batches), and for large batches, it takes about 30 days.
3. What are your payment terms?
Factory price, 30% deposit, 70%T/T payment before shipment.
4. What is the mode of transportation?
It can be transported by sea, air or express delivery (EMS, UPS, DHL, TNT, FEDEX, etc.). Please confirm with us before placing an order.
5. How do you help our business establish a long-term and good relationship?
We maintain good quality and competitive prices to ensure that our customers benefit.
2. We respect every customer as our friend. We do business with them sincerely and make friends with them, no matter where they come from.
Product Tags:
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FBGA-200 DRAM Memory Chip 8Gb X16 X2 Channel LPDDR4X IS43LQ32256B-062BLI Images
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